MTM Chiplet packaging

MTM.MTM was established in October 2020 with its headquarters located in Zhuzhou, Hunan Province. Possessing internationally leading advanced packaging technologies, MTM provides services including packaging design, multi-physics simulation, and one-stop SiP advanced packaging mass production. The company's product domains encompass computing power products, BeiDou navigation, automotive electronics, industrial control, power management, storage, biomedical, wearables, and IoT, having established strong cooperative relationships with over 200 clients. MTM delivers strong capabilities and reliable quality from its over 51,000-square-meter production facility. It has completed packaging production lines for Chiplet, SiP, CSP, LGA/BGA, QFN/DFN, and more. Through relentless innovation, exceptional teamwork, and high-quality products and services, MTM creates greater value for customers while continuously advancing the packaging industry. Key products include: Chiplet packaging, SiP packaging, CSP packaging, frame packaging, and fcBGA packaging.